Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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09383150
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Filing Dt:
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08/25/1999
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Inventor:
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RONG-FUH SHYU
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Title:
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LEAD FRAME FOR A SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP PACKAGE INCORPORATING MULTIPLE INTEGRATED CIRCUIT CHIPS, AND METHOD OF FABRICATING A SEMICONDUCTOR CHIP PACKAGE WITH MULTIPLE INTEGRATED CIRCUIT CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 4 R & D 3RD ROAD |
| HSINCHU CITY, TAIWAN |
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| CHRISTIE, PARKER & HALE, LLP |
| D. BRUCE PROUT |
| P.O. BOX 7068 |
| PASADENA, CA 91109-7068 |
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