Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/24/2004
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Application #:
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10170365
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Filing Dt:
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06/14/2002
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Publication #:
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Pub Dt:
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12/26/2002
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Inventor:
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Yoshihiro Yoneda
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Title:
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PACKAGING SUBSTRATE FOR ELECTRONIC ELEMENTS AND ELECTRONIC DEVICE HAVING PACKAGED STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 711, AZA SHARIDEN, OAZA KURITA |
| NAGANO-SHI NAGANO 380-0921, JAPAN |
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| STAAS & HALSEY LLP |
| ATTENTION: H. J. STAAS |
| 700 ELEVENTH STREET, N.W., SUITE 00 |
| WASHINGTON, D.C. 20001 |
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