Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/31/2004
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Application #:
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10457914
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Filing Dt:
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06/10/2003
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Inventors:
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Edmund B. Boucher, Harold M. Cook, Jose N. Diaz
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Title:
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THERMAL DISSIPATION PACKAGE FOR AN ELECTRICAL SURFACE MOUNT COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1303 EAST ALGONQUIN ROAD |
| LAW DEPARTMENT |
| SCHAUMBURG, ILLINOIS 60196 |
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| MOTOROLA, INC. |
| BARBARA R. DOUTRE |
| 8000 WEST SUNRISE BOULEVARD |
| LAW DEPARTMENT |
| FORT LAUDERDALE, FL 33322 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1303 E. ALGONQUIN ROAD |
| IL01-11TH FLOOR |
| SCHAUMBURG, ILLINOIS 60196 |
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| MOTOROLA SOLUTIONS, INC. |
| 1303 E. ALGONQUIN ROAD |
| IL01-11TH FLOOR |
| SCHAUMBURG, IL 60196 |
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