Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/14/2004
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Application #:
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10658270
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Filing Dt:
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09/10/2003
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Inventors:
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Yi-Lung Cheng, Ying-Lang Wang, We-Li Chen
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Title:
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METHOD FOR CAPPING OVER A COPPER LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN, CHINA 300-77 |
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| BIRCH, STEWART, KOLASCH ET.AL. |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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