Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/14/2004
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Application #:
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09997175
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Filing Dt:
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11/30/2001
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Publication #:
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Pub Dt:
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12/05/2002
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Inventors:
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Yoshihide Yamaguchi, Takao Terabayashi, Naoya Kanda, Hiroyuki Tenmei, Hiroshi Hozoji
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Title:
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A MULTI-CHIP MODULE INCLUDING SEMICONDUCTOR DEVICES AND A WIRING SUBSTRATE FOR MOUNTING THE SEMICONDUCTOR DEVICES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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CHIYODA-KU, |
6, KANDA SURUGADAI 4-CHOM, |
TOKYO,, JAPAN |
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ANTONELLI, TERRY |
STOUT & KRAUS LLP |
1300 NORTH SEVENTEENTH STREET |
SUITE 1800 |
ARLINGTON, VA 22209 |
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