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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/21/2004
Application #:
09796856
Filing Dt:
02/28/2001
Publication #:
Pub Dt:
08/23/2001
Inventors:
Jonathan D. Reid, David Smith, Steven T. Mayer, Jon Henri, Sesha Varadarajan
Title:
ELECTROPLATING PROCESS FOR AVOIDING DEFECTS IN METAL FEATURES OF INTEGRATED CIRCUIT DEVICES
Assignment: 1
Reel/Frame:
011685/0838Recorded: 02/28/2001Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/16/2001
Exec Dt:
02/20/2001
Exec Dt:
02/21/2001
Exec Dt:
02/23/2001
Exec Dt:
02/20/2001
Assignee:
4000 N. FIRST STREET
SAN JOSE, CALIFORNIA 95134
Correspondent:
SKJERVEN MORRILL MACPHERSON LLP
ROBERTA P. SAXON
25 METRO DRIVE, SUITE 700
SAN JOSE, CA 95110

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