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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
09/28/2004
Application #:
09830127
Filing Dt:
04/24/2001
Inventors:
Shosaku Ishihara, Masato Nakamura, Takaya Osawa, Takashi Kuroki, Shuzuo Sano, Mikio Izumi et al
Title:
MULTILAYER ELECTRONIC PART, ITS MANUFACTURING METHOD, TWO-DIMENSIONALLY ARRAYED ELEMENT PACKAGING STRUCTURE, AND ITS MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
012050/0557Recorded: 07/13/2001Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/25/2001
Exec Dt:
06/25/2001
Exec Dt:
06/28/2001
Exec Dt:
06/28/2001
Exec Dt:
06/28/2001
Exec Dt:
06/28/2001
Exec Dt:
06/28/2001
Assignees:
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU
TOKYO, JAPAN
1-14, UCHIKANDA 1-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS, LLP
MELVIN KRAUS
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON, VIRGINIA 22209
Assignment: 2
Reel/Frame:
020112/0598Recorded: 11/08/2007Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/17/2007
Assignee:
14-1, SOTOKANDA 4-CHOME
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS, LLP
1300 NORTH 17TH STREET
SUITE 1800
ARLINGTON, VA 22209

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