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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/28/2004
Application #:
09979374
Filing Dt:
11/16/2001
Publication #:
Pub Dt:
10/31/2002
Inventors:
Seiichi Nakatani, Yoshihiro Bessho, Yasuhiro Sugaya, Keiji Onishi
Title:
MODULE WITH BUILT-IN ELECTRONIC ELEMENTS AND METHOD OF MANUFACTURE THEREOF
Assignment: 1
Reel/Frame:
012436/0581Recorded: 11/16/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/02/2001
Exec Dt:
10/02/2001
Exec Dt:
10/02/2001
Exec Dt:
10/02/2001
Assignee:
1006-BANCHI OAZA-KADOMA KADOMA-SHI
OSAKA 571-8501, JAPAN
Correspondent:
MERCHANT & GOULD P.C.
DOUGLAS P. MUELLER
P.O. BOX 2903
MINNEAPOLIS, MN 55402-0903

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