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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/02/2004
Application #:
10378599
Filing Dt:
03/05/2003
Publication #:
Pub Dt:
09/25/2003
Inventors:
Toshiya Ikezawa, Takashige Saitou, Masaaki Tanaka
Title:
SEMICONDUCTOR DYNAMIC SENSOR HAVING CIRCUIT CHIP MOUNTED ON PACKAGE CASE WITH ADHESIVE FILM INTERPOSED
Assignment: 1
Reel/Frame:
013843/0503Recorded: 03/05/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/18/2003
Exec Dt:
02/18/2003
Exec Dt:
02/18/2003
Assignee:
1-1, SHOWA-CHO KARIYA-CITY
AICHI-PREF. 448-8661, JAPAN
Correspondent:
KERRY S. CULPEPPER
POSZ & BETHARDS, PLC
11250 ROGER BACON DRIVE SUITE 10
RESTON, VA 20190

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