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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/02/2004
Application #:
10318454
Filing Dt:
12/13/2002
Publication #:
Pub Dt:
06/17/2004
Inventors:
Chien-Chao Huang, Yee-Chia Yeo, Chenming Hu, Kuo-Nan Yang, Chun-Chieh Lin
Title:
METHOD OF FABRICATING A WAFER WITH STRAINED CHANNEL LAYERS FOR INCREASED ELECTRON AND HOLE MOBILITY FOR IMPROVING DEVICE PERFORMANCE
Assignment: 1
Reel/Frame:
013593/0455Recorded: 12/13/2002Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/20/2002
Exec Dt:
08/20/2002
Exec Dt:
08/20/2002
Exec Dt:
08/20/2002
Exec Dt:
08/20/2002
Assignee:
121 PARK AVE. 3
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN
Correspondent:
GEORGE O. SAILE
28 DAVIS AVE.
POUGHKEEPSIE, NY 12603

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