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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/16/2004
Application #:
10317053
Filing Dt:
12/12/2002
Inventors:
Minh Van Ngo, Christine Hau-Riege, Steve Avanzino, Robert A. Huertas
Title:
METHOD OF FORMING SIC CAPPED COPPER INTERCONNECTS WITH REDUCED HILLOCK FORMATION AND IMPROVED ELECTROMIGRATION RESISTANCE
Assignment: 1
Reel/Frame:
013583/0366Recorded: 12/12/2002Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/15/2002
Exec Dt:
11/21/2002
Exec Dt:
11/15/2002
Exec Dt:
11/21/2002
Assignee:
ONE AMD PLACE
P.O. BOX 3453
SUNNYVALE, CALIFORNIA 94088-3453
Correspondent:
MCDERMOTT, WILL & EMERY
ARTHUR J. STEINER
600 13TH STREET, N.W.
WASHINGTON, DC 20005

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