Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/16/2004
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Application #:
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10692065
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Filing Dt:
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10/23/2003
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Publication #:
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Pub Dt:
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05/06/2004
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Inventors:
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John Harold Magerlein, Kevin Shawn Petrarca, Sampath Purushothaman et al
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Title:
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HIGH DENSITY AREA ARRAY SOLDER MICROJOINING INTERCONNECT STRUCTURE AND FABRICATION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3050 ZANKER ROAD |
| SAN JOSE, CALIFORNIA 95134 |
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| ALLSTON L. JONES |
| 425 SHERMAN AVENUE, SUITE 230 |
| PALO ALTO, CA 94306 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 TERMINAL DRIVE |
| PLAINVIEW, NEW YORK 11803 |
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| ALAN P KASS |
| 394 ELIZABETH AVENUE |
| SOMERSET, NJ 08873 |
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Assignment:
3
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PATENT SECURITY AGREEMENT
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| 95 WASHINGTON STREET, FLOOR 2SOUTH |
| BUFFALO, NEW YORK 14203 |
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| LINDA A. SALERA, SENIOR PARALEGAL |
| ONE FEDERAL STREET |
| C/O MORGAN, LEWIS & BOCKIUS LLP |
| BOSTON, MA 02110 |
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