Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/23/2004
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Application #:
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10416839
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Filing Dt:
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05/15/2003
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Inventors:
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Akira Yamauchi, Yoshiyuki Arai
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Title:
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TOOL FOR THERMO-COMPRESSION-BONDING CHIPS, AND CHIP PACKAGING DEVICE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-3, NAKANOSHIMA 3-CHOME, KITA-KU, OSAKA-SHI |
| NAKANOSHIMA MITSUI BUILDING |
| OSAKA, JAPAN 530-8222 |
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| RADER, FISHMAN & GRAUER PLLC |
| DAVID T. NIKAIDO |
| 1233 20TH STREET, N.W. |
| STE. 501 |
| WASHINGTON, DC 20036 |
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