Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/30/2004
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Application #:
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10215517
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Filing Dt:
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08/09/2002
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Publication #:
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Pub Dt:
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10/02/2003
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Inventors:
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Ping Wu, Kewu Bai
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Title:
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LEAD FREE TIN BASED SOLDER COMPOSITION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1 SCIENCE PARK ROAD #01-01 TEH CAPRICORN |
| SINGAPORE SCIENCE PART II, SINGAPORE 117528 |
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| BEYER WEAVER & THOMAS, LLP |
| P. O. BOX 778 |
| BERKELY, CA 94704-0778 |
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