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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/07/2004
Application #:
09959660
Filing Dt:
11/02/2001
Publication #:
Pub Dt:
10/31/2002
Inventor:
Hiroshi Yagi
Title:
RESIN-ENCAPSULATED PACKAGE, LEAD MEMBER FOR THE SAME AND METHOD OF FABRICATING THE LEAD MEMBER
Assignment: 1
Reel/Frame:
012324/0411Recorded: 11/02/2001Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/23/2001
Assignee:
1-1, ICHIGAYA-KAGA-CHO 1-CHOME
SHINJUKU-KU, TOKYO-TO, JAPAN
Correspondent:
PARKHURST & WENDEL, L.L.P.
ROGER W. PARKHURST
SUITE 210
1421 PRINCE STREET
ALEXANDRIA, VA 22314-2805

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