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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/11/2005
Application #:
10244196
Filing Dt:
09/16/2002
Publication #:
Pub Dt:
11/06/2003
Inventors:
Joo-Hoon Lee, Duk-Yong Choi, Dong-Su Kim
Title:
FLIP-CHIP BONDING STRUCTURE AND METHOD FOR MAKING THE SAME
Assignment: 1
Reel/Frame:
013303/0648Recorded: 09/16/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/13/2002
Exec Dt:
09/13/2002
Exec Dt:
09/13/2002
Assignee:
416, MAETAN-DONG, PALDAL-GU
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
KLAUBER & JACKSON
STEVE CHA
411 HACKENSACK AVENUE, 4TH FLOOR
HACKENSACK, NEW JERSEY 07601

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