Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/11/2005
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Application #:
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09709523
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Filing Dt:
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11/13/2000
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Inventors:
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Seong-Kweon Ha, Jong-Hun Kim
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Title:
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SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUBAL-EUB |
| SAN 136-1, AMI-RI |
| ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| MORGAN, LEWIS & BOCKIUS LLP |
| WILLIAM O. TROUSDELL |
| 1800 M STREET, NW |
| WASHINGTON, DC 20036 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB |
| ICHON, KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| JACOBSON HOLMAN PLLC |
| 400 SEVENTH STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20004 |
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