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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/15/2005
Application #:
10147350
Filing Dt:
05/17/2002
Publication #:
Pub Dt:
12/19/2002
Inventors:
Osamu Yamazaki, Hideo Senoo, Kazuyoshi Ebe
Title:
TAPE FOR FORMING RESIN TIE BAR, RESIN TIE BAR, LEAD FRAME EQUIPPED WITH RESIN TIE BAR, RESIN-MOLDED SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING SAME
Assignment: 1
Reel/Frame:
013208/0079Recorded: 08/16/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/15/2002
Exec Dt:
05/15/2002
Exec Dt:
05/15/2002
Assignee:
23-23, HON-CHO
ITABASHI-KU, TOKYO 173-0001, JAPAN
Correspondent:
LAW OFFICES OF DAVID G. POSZ
KERRY S. CULPEPPER
2000 L STREET NW, SUITE 200
WASHINGTON, DC 20036

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