Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/15/2005
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Application #:
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10747862
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Filing Dt:
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12/29/2003
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Inventors:
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John C. Ehmke, Vincent C. Lopes, John Paul Harris
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Title:
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METHOD FOR FABRICATING A LID FOR A WAFER LEVEL PACKAGED OPTICAL MEMS DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95052 |
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| DALY, CROWLEY, MOFFORD & DURKEE, LLP |
| P.O. BOX 62050 |
| MINNEAPOLIS, MN 55402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| P.O. BOX 655474 |
| M/S 3999 |
| DALLAS, TEXAS 75265 |
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| TEXAS INSTRUMENTS INCORPORATED |
| IRA S. MATSIL |
| P.O. BOX 655474 |
| M/S 3999 |
| DALLAS, TX 75265 |
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Assignment:
3
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CORRECTIVE ASSIGNMENT TO CORRECT NAMED INVENTOR, PREVIOUSLY RECORDED ON REEL/FRAME 014603/0242
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| P.O. BOX 655474, MS 3999 |
| DALLAS, TEXAS 75265 |
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| TEXAS INSTRUMENTS INCORPORATED |
| CHARLIE BRILL |
| P.O. BOX 655474, MS 3999 |
| DALLAS, TX 75265 |
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