Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/22/2005
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Application #:
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10700713
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Filing Dt:
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11/03/2003
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Inventors:
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Bradley Bower, Quan Qi, Kirby Sand
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Title:
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SYSTEM AND A METHOD FOR FLUID FILLING WAFER LEVEL PACKAGES
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE OF THE ASSIGNOR'S, PREVIOUSLY RECORDED ON REEL 014667 FRAME 0331.
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| 20555 SH 249 |
| HOUSTON, TEXAS 77070 |
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| HEWLETT-PACKARD COMPANY |
| DEBBIE SCHARPEN |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| P.O. BOX 272400 |
| FORT COLLINS, CO 80527-2400 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20555 SH 249 |
| HOUSTON, TEXAS 77070 |
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| HEWLETT-PACKARD COMPANY |
| STEVEN L. NICHOLS |
| P.O. BOX 272400 |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| FORT COLLINS, CO 80527-2400 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 416 MAETAN-DONG |
| YEONGTONG-GU, SUWON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| ROBERT N. CROUSE |
| MYERS BIGEL SIBLEY & SAJOVEC |
| P.O. BOX 37428 |
| RALEIGH, NC 27627 |
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