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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
03/01/2005
Application #:
10136119
Filing Dt:
05/01/2002
Inventor:
Eran Rotem
Title:
FLIP CHIP WITH NOVEL POWER AND GROUND ARRANGEMENT
Assignment: 1
Reel/Frame:
012857/0139Recorded: 05/01/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/01/2002
Assignee:
MOSHAV MANOF D.N.
MISGAV, ISRAEL 20184
Correspondent:
MARVELL SEMICONDUCTOR, INC.
ERIC B. JANOSFSKY
700 FIRST AVENUE, MAIL STOP 509
SUNNYVALE, CA 94089
Assignment: 2
Reel/Frame:
014015/0846Recorded: 05/01/2003Pages: 3
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/15/2002
Assignee:
POB 6374
KARMIEL, ISRAEL 20100
Correspondent:
MARVELL SEMICONDUCTOR, INC.
ANDREW J. BATEMAN
700 FIRST AVENUE, MAIL STOP 509
SUNNYVALE, CA 94089
Assignment: 3
Reel/Frame:
021205/0502Recorded: 07/08/2008Pages: 6
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/28/2008
Assignee:
6 HAMADA STREET
MORDOT HACARMEL INDUSTRIAL PARK
YOKNEAM, ISRAEL 20692
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
5445 CORPORATE DRIVE
SUITE 200
TROY, MI 48098

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