Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/15/2005
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Application #:
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09435324
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Filing Dt:
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11/05/1999
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Inventor:
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IGAL LADABAUM
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Title:
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METHOD OF AND APPARATUS FOR WAFER-SCALE PACKAGING OF SURFACE MICROFABRICATED TRANSDUCERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 650 SARATOGA AVENUE |
| SAN JOSE, CALIFORNIA 95129 |
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| PILLSBURY MADISON & SUTRO LLP |
| 1100 NEW YORK AVENUE NW |
| 9TH FLOOR, EAST TOWER |
| WASHINGTON, DC 20005-3918 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 51 VALLEY STREAM PARKWAY |
| MALVERN, PENNSYLVANIA 19355 |
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| SIEMENS CORPORATION |
| 170 WOOD AVENUE SOUTH |
| ATTN: ELSA KELLER, LEGAL ADMINISTRATOR |
| ISELIN, NJ 08830 |
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