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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/22/2005
Application #:
10236939
Filing Dt:
09/09/2002
Publication #:
Pub Dt:
03/27/2003
Inventors:
Kwang-Myung Lee, Mikio Takagi, Jae-Hyuk An, Seung-Ki Chae, Jea-Wook Kim
Title:
METHOD FOR PROCESSING A WAFER AND APPARATUS FOR PERFORMING THE SAME
Assignment: 1
Reel/Frame:
013279/0039Recorded: 09/09/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/08/2002
Exec Dt:
08/08/2002
Exec Dt:
08/08/2002
Exec Dt:
08/08/2002
Exec Dt:
08/08/2002
Assignee:
416 MAEAN-DONG, PALDAL-GU
SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Correspondent:
LEE & STERBA, P.C.
EUGENE M. LEE
1101 WILSON BLVD.
STE. 2000
ARLINGTON, VA 22209

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