Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/29/2005
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Application #:
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10360845
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Filing Dt:
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02/06/2003
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Publication #:
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Pub Dt:
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08/12/2004
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Inventors:
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Jan I. Strandberg, Richard Scott Trevino, Thomas B. Blount
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Title:
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HIGH DENSITY CHIP LEVEL PACKAGE FOR THE PACKAGING OF INTEGRATED CIRCUITS AND METHOD TO MANUFACTURE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2751 CENTERVILLE ROAD |
LITTLE FALLS CENTER II |
WILMINGTON, DELAWARE 19808 |
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TOWNSEND AND TOWNSEND AND CREW LLP |
WILLIAM L. SHAFFER |
TWO EMBARCADERO CENTER, 8TH FLOOR |
SAN FRANCISCO, CALIFORNIA 94111-3834 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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2101 BLAIR MILL ROAD |
WILLOW GROVE, PENNSYLVANIA 19090 |
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CHRISTOPHER M. SPLETZER, SR. |
2101 BLAIR MILL ROAD |
WILLOW GROVE, PA 19090 |
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