Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/19/2005
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Application #:
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10721263
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Filing Dt:
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11/26/2003
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Publication #:
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Pub Dt:
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06/17/2004
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Inventors:
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Johshi Gotoh, Tatsuya Okuno
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Title:
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UNDERFILLING MATERIAL FOR SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| VICTORIA HOUSE, ROUTE DE LA PIERRE, 22 |
| ECUBLENS, SWITZERLAND 1024 |
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| JACOBSON HOLMAN PLLC |
| 400 SEVENTH STREET N.W. |
| SUITE 600 |
| WASHINGTON, DC 20004 |
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