Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/26/2005
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Application #:
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10153451
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Filing Dt:
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05/22/2002
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Publication #:
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Pub Dt:
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09/26/2002
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Inventors:
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Timothy W. Ellis, Nikhil Murdeshwar, Mark A. Eshelman, Christian Rheault
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Title:
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SEMICONDUCTOR COPPER BOND PAD SURFACE PROTECTION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 300 DELAWARE AVENUE |
| SUITE 533 |
| WILMINGTON, DELAWARE 19801-1622 |
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| PETER J. BUTCH III, ESQ. |
| P.O. BOX 592 |
| PRINCETON, NJ 08542-0592 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1005 VIRGINIA DRIVE |
| FORT WASHINGTON, PENNSYLVANIA 19034 |
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| CHRISTOPHER M. SPLETZER, SR. |
| 1005 VIRGINIA DRIVE |
| FORT WASHINGTON, PA 19034 |
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