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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
6885522
Issue Dt:
04/26/2005
Application #:
09548313
Filing Dt:
04/12/2000
Inventors:
Hidehiko Kira, Shunji Baba, Norio Kainuma, Takeshi Komiyama, Toru Okada et al
Title:
HEAD ASSEMBLY HAVING INTEGRATED CIRCUIT CHIP COVERED BY LAYER WHICH PREVENTS FOREIGN PARTICLE GENERATION
Assignment: 1
Reel/Frame:
010735/0862Recorded: 04/12/2000Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
KIRA, HIDEHIKO
Exec Dt:
03/24/2000
BABA, SHUNJI
Exec Dt:
03/24/2000
KAINUMA, NORIO
Exec Dt:
03/24/2000
OKADA, TORU
Exec Dt:
03/24/2000
YAMAKAMI, TAKATOYO
Exec Dt:
03/24/2000
SASAKI, YASUNORI
Exec Dt:
03/24/2000
KOMIYAMA, TAKESHI
Exec Dt:
03/24/2000
KOBAE, KENJI
Exec Dt:
03/24/2000
KOBAYASHI, HIROSHI
Exec Dt:
03/24/2000
Assignee:
FUJITSU LIMITED
NAKAHARA-KU, KAWASAKI-SHI
1-1, KAMIKODANAKA 4-CHOME
KANAGAWA 211-8588, JAPAN
Correspondent:
ARMSTRONG, WESTERMAN, HATTORI ET AL.
STEPHEN G. ADRIAN
1725 K STREET, NW
SUITE 1000
WASHINGTON, DC 20006
Assignment: 2
Reel/Frame:
023861/0881Recorded: 10/26/2009Pages: 24
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
FUJITSU LIMITED
Exec Dt:
10/14/2009
Assignee:
TOSHIBA STORAGE DEVICE CORPORATION
1-1, SHIBAURA 1-CHOME
MINATO-KU, TOKYO, JAPAN 105-8001
Correspondent:
DAVID J. CUSHING
2100 PENNSYLVANIA AVENUE, N.W.
WASHINGTON, DISTRICT OF COLUMBIA 20037

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