Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/03/2005
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Application #:
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10413574
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Filing Dt:
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04/15/2003
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Publication #:
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Pub Dt:
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01/01/2004
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Inventors:
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Tadatomo Suga, Keisuke Saito, Rikiya Kato, Sakie Yamagata
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Title:
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RESIDUE-FREE SOLDER PASTE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6-3 HIGASHINAKANO |
| NAKANO-KU, TOKYO, JAPAN |
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO 120-8555, JAPAN |
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| MICHAEL TOBIAS |
| #40 |
| 1717 K STREET N.W. |
| SUITE 613 |
| WASHINGTON, D.C. 20036 |
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