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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/31/2005
Application #:
10224639
Filing Dt:
08/21/2002
Publication #:
Pub Dt:
02/26/2004
Inventors:
David Liu, Chengping Zhang, Michael T. Duignan
Title:
METHOD AND COMPONENTS FOR MANUFACTURING MULTI-LAYER MODULAR ELECTRICAL CIRCUITS
Assignment: 1
Reel/Frame:
013216/0490Recorded: 08/21/2002Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/14/2002
Exec Dt:
08/14/2002
Exec Dt:
08/14/2002
Assignee:
4445 NICOLE DRIVE
LANHAM, MARYLAND 20706
Correspondent:
ROSENBERG, KLEIN & LEE
MORTON J. ROSENBERG
3458 ELLICOTT CENTER DRIVE
SUITE 101
ELLICOT CITY, MD 21043

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