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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
06/21/2005
Application #:
10325056
Filing Dt:
12/20/2002
Publication #:
Pub Dt:
06/24/2004
Inventors:
Hawk Yin Pang, Kenichi Hashizume
Title:
GROUNDED EMBEDDED FLIP CHIP RF INTEGRATED CIRCUIT
Assignment: 1
Reel/Frame:
013846/0775Recorded: 03/11/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/25/2003
Exec Dt:
02/25/2003
Assignee:
KEILALAHDENTIE 4
ESPOO, FINLAND FIN-02150
Correspondent:
HARRINGTON, SMITH, LLP
HARRY F. SMITH
4 RESEARCH DRIVE
SHELTON, CT 06484-6212
Assignment: 2
Reel/Frame:
035495/0909Recorded: 04/25/2015Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/16/2015
Assignee:
KARAPORTTI 3
ESPOO, FINLAND 02610
Correspondent:
NOKIA USA INC.
200 SOUTH MATHILDA AVE
ATTN: INTELLECTUAL PROPERTY
SUNNYVALE, CA 94086

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