Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/21/2005
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Application #:
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10719451
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Filing Dt:
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11/20/2003
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Inventors:
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Wen-Chou Vincent Wang, Donald S. Fritz, Yuan Li
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Title:
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STRUCTURE AND MATERIAL FOR ASSEMBLING A LOW-K SI DIE TO ACHIEVE A LOW WARPAGE AND INDUSTRIAL GRADE RELIABILITY FLIP CHIP PACKAGE WITH ORGANIC SUBSTRATE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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101 INNOVATION DRIVE |
SAN JOSE, CALIFORNIA 95134 |
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BEYER WEAVER & THOMAS, LLP |
DESMUND GEAN |
P.O. BOX 778 |
BERKELEY, CA 94704-0778 |
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