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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
08/02/2005
Application #:
10279977
Filing Dt:
10/25/2002
Publication #:
Pub Dt:
03/11/2004
Inventor:
Ki Bon Cha
Title:
STACK PACKAGE AND MANUFACTURING METHOD THEREOF
Assignment: 1
Reel/Frame:
015967/0807Recorded: 05/02/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/02/2005
Assignee:
#805 DAIHYUN TECHNOWORLD, 174 OJEON-DONG, UIWANG-SHI,
KYEONGKI-DO, KOREA, DEMOCRATIC PEOPLE'S REPUBLIC OF
Correspondent:
JEAN C. EDWARDS
1901 L. STREET N.W.
SUITE 800
WASHINGTON, DC 22316
Assignment: 2
Reel/Frame:
023208/0716Recorded: 09/11/2009Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/10/2009
Assignee:
#1053-603B 17L, SINGIL-DONG, DANWON-GU
ANSAN-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Correspondent:
JAE Y. PARK
KILE, GOEKJIAN, REED & MCMANUS PLLC
1200 NEW HAMPSHIRE AVE NW
WASHINGTON, DC 20036

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