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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/13/2005
Application #:
09916305
Filing Dt:
07/30/2001
Publication #:
Pub Dt:
01/17/2002
Inventors:
Yutaka Wada, Hirokuni Hiyama, Hisanori Matsuo, Kazuto Hirokawa
Title:
POLISHING METHOD USING AN ABRADING PLATE
Assignment: 1
Reel/Frame:
012157/0138Recorded: 09/12/2001Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/23/2001
Exec Dt:
08/23/2001
Exec Dt:
08/23/2001
Exec Dt:
08/23/2001
Assignee:
11-1 HANEDA ASAHI-CHO, OHTA-KU
TOKYO, JAPAN
Correspondent:
WENDEROTH, LIND & PONACK, LLP
ATTN: NILS E. PEDERSEN, ESQ.
2033 K ST., NW - SUITE 800
WASHINGTON, DC 20006-1021

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