Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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09/13/2005
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Application #:
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10687085
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Filing Dt:
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10/17/2003
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Publication #:
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Pub Dt:
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11/25/2004
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Inventor:
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Hiroshi Maeda
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Title:
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FLIP CHIP MOUNTING METHOD OF FORMING A SOLDER BUMP ON A CHIP PAD THAT IS EXPOSED THROUGH AN OPENING FORMED IN A POLYIMIDE FILM THAT INCLUDES UTILIZING UNDERFILL TO BOND THE CHIP TO A SUBSTRATE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN |
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| OBLON, SPIVAK, MCCLELLAND, MAIER, ET AL |
| MARVIN J. SPIVAK |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI |
| KANAGAWA, JAPAN |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
3
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI |
| KANAGAWA, JAPAN |
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| OBLON, SPIVAK, ET AL. |
| 1940 DUKE STREET |
| ALEXANDRIA, VA 22314 |
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Assignment:
4
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD |
| SUITE 210 |
| ALEXANDRIA, VA 22314 |
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