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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/08/2005
Application #:
10867941
Filing Dt:
06/14/2004
Publication #:
Pub Dt:
02/03/2005
Inventors:
Hsieh Kun Lee, Tao Li, Jin Song Feng
Title:
HEAT DISSIPATION ASSEMBLY WITH RETAINING DEVICE
Assignment: 1
Reel/Frame:
015475/0820Recorded: 06/14/2004Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/06/2004
Exec Dt:
02/06/2004
Exec Dt:
02/06/2004
Assignee:
66 CHUNG SHAN ROAD
TU-CHEN, TAIPEI HSIEN, TAIWAN
Correspondent:
FOXCONN INTERNATIONAL, INC.
WEI TE (JOSEPH) CHUNG
1650 MEMOREX DR.
SANTA CLARA, CA 95050

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