Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/29/2005
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Application #:
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09594502
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Filing Dt:
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06/16/2000
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Inventor:
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Tomohiro Hashii
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Title:
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SEMICONDUCTOR WAFER GRINDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CHUO-KU |
| 5-33, KITAHAMA 4-CHOME |
| OSAKA-SHI, OSAKA, JAPAN 541-0 |
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| KEVIN R. SPIVAK |
| MORRISON & FOERSTER LLP |
| 2000 PENNSYLVANIA AVENUE NW |
| WASHINGTON, D.C. 20006-1888 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2-1 SHIBAURA, MINATO-KU |
| TOKYO 105-8634, JAPAN |
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| ARMSTRONG, WESTERMAN & HATTORI, LLP |
| DONALD W. HANSON |
| STE. 1000 |
| 1725 K STREET, N.W. |
| WASHINGTON, DC 20006 |
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