Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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12/13/2005
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Application #:
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09395179
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Filing Dt:
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09/14/1999
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Inventors:
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KENICHI FUNAMOTO, HIDETOSHI NODA, MASAAKI ISHIO
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Title:
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PACKAGE FOR ELECTRONIC COMPONENT, LID MATERIAL FOR PACKAGE LID, AND PRODUCTION METHOD FOR LID MATERIAL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-19, KITAHAMA 4-CHOME |
| CHUO-KU, OSAKA-SHI, OSAKA, JAPAN |
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| NIKAIDO, MARMELSTEIN, MURRAY & ORAM LLP |
| GEORGE E. ORAM, JR. |
| METROPOLITAN SQUARE, G STREET LOBBY |
| 655 15TH ST., N.W., SUITE 330 |
| WASHINGTON, D.C. 20005-5701 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 4-7-19, KITAHAMA, CHUO-KU |
| OSAKA-SHI, OSAKA, JAPAN 541-0041 |
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| KEATING & BENNETT, LLP |
| JOSEPH R. KEATING |
| 10400 EATON PLACE |
| SUITE 312 |
| FAIRFAX, VA 22030 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 19-1, MINAMISUITA 2-CHOME |
| SUITA-SHI, OSAKA, JAPAN 564-0043 |
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| JOSEPH R. KEATING |
| 10400 EATON PLACE, SUITE 312 |
| FAIRFAX, VA 22030 |
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