Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/20/2005
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Application #:
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10641606
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Filing Dt:
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08/15/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Inventor:
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Shinji Takase
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Title:
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RESIN ENCAPSULATION MOLDING METHOD OF ELECTRONIC PART AND RESIN ENCAPSULATION MOLDING APPARATUS USED THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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5, KAMITOBA KAMICHOSHI-CHO |
MINAMI-KU, KYOTO-SHI |
KYOTO, JAPAN |
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FASSE PATENT ATTORNEYS |
P.O. BOX 726 |
HAMPDEN, MAINE 04444-0726 |
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