Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/27/2005
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Application #:
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10433933
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Filing Dt:
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10/21/2003
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Publication #:
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Pub Dt:
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07/15/2004
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Inventors:
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Kouichi Takashima, Shin-ichi Yamagata, Akira Sasame, Yugaku Abe
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Title:
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SEMICODUCTOR HEAT-DISSIPATING SUBSTRATE, AND MANUFACTURING METHOD AND PACKAGE THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 4-CHOME, CHUO-KU |
| OSAKA, JAPAN 541-0041 |
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| JAMES W. JUDGE |
| RIVIERE SHUKUGAWA 3RD FL. |
| 3-1 WAKAMATSU-CHO |
| NISHINOMIYA, JAPAN 662-0035 |
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