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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/27/2005
Application #:
09266237
Filing Dt:
03/10/1999
Inventors:
WARREN M. FARNWORTH, SALMAN AKRAM
Title:
TEST INTERCONNECT FOR BUMPED SEMICONDUCTOR COMPONENTS AND METHOD OF FABRICATION
Assignment: 1
Reel/Frame:
009829/0075Recorded: 03/10/1999Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/08/1999
Exec Dt:
03/08/1999
Assignee:
LEGAL DEPARTMENT M/S
8000 SOUTH FEDERAL WAY
BOISE, IDAHO 83706
Correspondent:
STEPHEN A. GRATTON
2764 SOUTH BRAUN WAY
LAKEWOOD, CO 80228

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