Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10668483
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Filing Dt:
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09/22/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Inventors:
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Takeshi Ootsuka, Mamoru Kosakai
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Title:
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BONDING METHOD, BONDING STAGE AND ELECTRONIC COMPONENT PACKAGING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6-28, ROKUBAN-CHO, CHIYODA-KU |
| TOKYO, JAPAN |
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| OSTROLENK, FABER, GERB & SOFFEN ET AL. |
| MAX MOSKOWITZ |
| 1180 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036-8403 |
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