Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/31/2006
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Application #:
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10626344
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Filing Dt:
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07/24/2003
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Publication #:
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Pub Dt:
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10/14/2004
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Inventors:
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Jong Soo Cho, Yong Jin Park, Sung Jae Hong
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Title:
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GOLD ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 316-2 KEUMUH-RI, POGOK-MYUN |
| KYUNGKI-DO |
| YONGIN-CITY REPUBLIC OF, KOREA, REPUBLIC OF |
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| VOLPE AND KOENIG, P.C. |
| RUY M. GARCIA-ZMOR |
| UNTIED PLAZA, SUITE 1600 |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, PA 19103 |
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