Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/14/2006
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Application #:
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10299567
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Filing Dt:
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11/19/2002
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Publication #:
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Pub Dt:
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05/20/2004
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Inventors:
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Jeffrey B. Danielson, Balaram Ghosal, James Kuss, Matthew Wayne Oonk, Roy Yu et al
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Title:
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THIN FILM TRANSFER JOIN PROCESS AND MULTILEVEL THIN FILM MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NEW ORCHARD ROAD |
ARMONK, NEW YORK 10504 |
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IBM CORPORATION |
IRA D. BLECKER |
2070 ROUTE 52, INTELL PROP. LAW DEPT. |
DEPT. 18G/BLDG. 300-482 |
HOPEWELL JUNCTION, NY 12533-6531 |
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