Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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02/21/2006
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Application #:
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10636993
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Filing Dt:
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08/06/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Inventors:
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Timothy V. Harper, Greg L. Allen
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Title:
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INTEGRATED CIRCUIT PACKAGE EMPLOYING FLIP-CHIP TECHNOLOGY AND METHOD OF ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 395 PAGE MILL ROAD |
| PALO ALTO, CALIFORNIA 94306-2024 |
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| HEWLETT-PACKARD COMPANY |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| RECORDS MANAGER |
| P.O. BOX 272400 |
| FORT COLLINS, CO 80527-2400 |
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Assignment:
2
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CLARIFICATION TO PATENT AND PATENT APPLICATION ASSIGNMENT
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| 3000 HANOVER STREET |
| PALO ALTO, CALIFORNIA 94304-1112 |
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| 20555 S.H. 249 |
| HOUSTON, TEXAS 77070 |
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| 395 PAGE MILL ROAD |
| PALO ALTO, CALIFORNIA 94306-2024 |
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| RECORDS MANAGER |
| INTELLECTUAL PROPERTY ADMINISTRATION |
| HEWLETT-PACKARD COMPANY |
| P.O. BOX 272400 |
| FORT COLLINS, CO 80527-2400 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8 CROSS STREET, #11-00 PWC BUILDING |
| SINGAPORE, SINGAPORE 048424 |
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| AVAGO TECHNOLOGIES, LTD. |
| P.O. BOX 1920 |
| DENVER, CO 80201-1920 |
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Assignment:
4
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 017206 FRAME: 0666. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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| 8 CROSS STREET, #11-00 PWC BUILDING |
| SINGAPORE, SINGAPORE 048424 |
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| LATHAM & WATKINS LLP |
| 650 TOWN CENTER DRIVE, SUITE 2000 |
| COSTA MESA, CA 92626 |
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