Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/28/2006
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Application #:
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10867382
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Filing Dt:
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06/14/2004
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Publication #:
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Pub Dt:
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02/03/2005
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Inventor:
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Jerome Teysseyre
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Title:
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PROCESS FOR ENCAPSULATING SEMICONDUCTOR COMPONENTS USING THROUGH-HOLES IN THE SEMICONDUCTOR COMPONENTS SUPPORT SUBSTRATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 29 BOULEVARD ROMAIN ROLLAND |
| 92120 MONTROUGE, FRANCE |
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| FLEIT KAIN GIBBONS GUTMAN BONGINI & |
| BIANCO PL - JON A. GIBBONS |
| ONE BOCA COMMERCE CENTER |
| 551 NORTHWEST 77TH STREET, SUITE 111 |
| BOCA RATON, FL 33487 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 29 BOULEVARD ROMAIN ROLLAND |
| MONTROUGE, FRANCE 92120 |
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| TESSA MCCLURE |
| 701 FIFTH AVENUE, SUITE 5400 |
| SEED IP LAW GROUP LLP |
| SEATTLE, WA 98104 |
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