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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/21/2006
Application #:
10157012
Filing Dt:
05/30/2002
Publication #:
Pub Dt:
12/05/2002
Inventors:
Hiroshi Sakai, Motoji Suzuki, Makoto Igarashi, Akihiro Tanaka
Title:
METHOD OF PACKAGING ELECTRONIC COMPONENTS WITHOUT CREATING UNNECESSARY SOLDER BALLS
Assignment: 1
Reel/Frame:
013143/0125Recorded: 08/01/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/17/2002
Exec Dt:
07/17/2002
Exec Dt:
07/17/2002
Exec Dt:
07/17/2002
Assignee:
7-1, SHIBA 5-CHOME, MINATO-KU
TOKYO, JAPAN
Correspondent:
FOLEY & LARDNER
DAVID A. BLUMENTHAL
WASHINGTON HARBOUR
3000 K ST., NW STE. 500
WASHINGTON, DC 20007-5143
Assignment: 2
Reel/Frame:
027154/0570Recorded: 11/01/2011Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/01/2011
Assignee:
11-1, OSAKI 1-CHOME, SHINAGAWA-KU
TOKYO, JAPAN 141-0032
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE NW, SUITE 800
WASHINGTON, DC 20037

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