Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2006
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Application #:
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10398653
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Filing Dt:
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10/07/2003
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Publication #:
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Pub Dt:
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07/22/2004
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Inventors:
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Hideo Kawai, Katsumi Tanaka, Takahiro Aoyama, Mitsuo Nakazaki
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Title:
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PACKAGING MATERIAL FOR ELECTRONIC-PART CASE, AND OTHERS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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31, SUZUKAWA, ISEHARA-SHI |
KANAGAWA 259-1146, JAPAN |
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1-1, KORAIBASHI 4-CHOME, CHUO-KU, OSAKA-SHI |
OSAKA 541-0043, JAPAN |
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OBLON, SPIVAK, MCCLELLAND, ET AL. |
MASAYASU MORI |
1940 DUKE STREET |
ALEXANDRIA, VIRGINIA 22202 |
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