Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/25/2006
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Application #:
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10919580
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Filing Dt:
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08/17/2004
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Publication #:
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Pub Dt:
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03/31/2005
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Inventors:
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Hiizu Ohtorii, Kaori Tai, Hiroshi Horikoshi, Naoki Komai, Shuzo Sato
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Title:
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ETCHING SOLUTION, ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-35 KITASHINAGAWA 6-CHOME |
| SHINAGAWA-KU |
| TOKYO, JAPAN |
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| ROBERT J. DEPKE |
| HOLLAND & KNIGHT LLP |
| 131 S DEARBORN ST., 30TH FLOOR |
| CHICAGO, IL 60603 |
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