Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/02/2006
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Application #:
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09587768
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Filing Dt:
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06/06/2000
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Inventors:
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Seiichi Nakatani, Koichi Hirano, Mitsuhiro Matsuo, Hiroyuki Handa
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Title:
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POWER MODULE WITH IMPROVED HEAT DISSIPATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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OAZA-KADOMA |
1006-BANCHI |
KADOMA-SHI, OSAKA 571-8501, JAPAN |
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MERCHANT & GOULD P.C. |
DOUGLAS P. MUELLER |
P.O. BOX 2903 |
MINNEAPOLIS, MN 55402-0903 |
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