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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
7038316
Issue Dt:
05/02/2006
Application #:
10811370
Filing Dt:
03/25/2004
Publication #:
20050211749
Pub Dt:
09/29/2005
Inventors:
Chuan Hu, Daoqiang Lu, Zhiyong Wang, Gilroy Vandentop
Title:
BUMPLESS DIE AND HEAT SPREADER LID MODULE BONDED TO BUMPED DIE CARRIER
Assignment: 1
Reel/Frame:
015163/0486Recorded: 03/25/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HU, CHUAN
Exec Dt:
03/18/2004
LU, DAOGIANG
Exec Dt:
03/18/2004
WANG, ZHIYONG
Exec Dt:
03/18/2004
VANDENTOP, GILROY
Exec Dt:
03/19/2004
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
SCHWABE, WILLIAMSON & WYATT, P.C.
ALOYSIUS T.C. AUYEUNG
1211 SW FIFTH AVENUE
SUITES 1600-1900
PORTLAND, OR 97204
Assignment: 2
Reel/Frame:
015916/0804Recorded: 10/25/2004Pages: 4
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF A CONVEYING PARTIE'S NAME AS PRVIOUSLY RECORDED AT REEL 015163 FRAME 0486
Assignors:
HU, CHUAN
Exec Dt:
03/18/2004
LU, DAOQIANG
Exec Dt:
03/18/2004
WANG, ZHIYONG
Exec Dt:
03/18/2004
VANDENTOP, GILROY
Exec Dt:
03/19/2004
Assignee:
INTEL CORPORATION
2200 MISSION COLLEGE BLVD.
SANTA CLARA, CALIFORNIA 95052
Correspondent:
SCHWABE, WILLIAMSON & WYATT, P.C.
SUITES 1600-1900
1211 SW FIFTH AVE.
PORTLAND, OR 97204

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